EBSD Investigation of Cu-Sn IMC Microstructural Evolution in Cu/Sn-Ag/Cu Microbumps During Isothermal Annealing
作者： S. J. Wang , L. H. Hsu , N. K. Wang , C. E. Ho
DOI: 10.1007/S11664-013-2675-Z
关键词:
摘要: The microstructural evolution of Cu/Sn-Ag (~5 μm)/Cu Cu-bump-on-line (CuBOL) joints during isothermal annealing at 180°C was examined using a field-emission scanning electron microscope equipped with an backscatter diffraction (EBSD) system. Cu6Sn5 and Cu3Sn were the two key intermetallic compound (IMC) species that appeared in CuBOL joints. After for 24 h (= t), solder had completely converted to Cu-Sn IMCs, forming “IMC” joint Cu/Cu3Sn/Cu6Sn5/Cu3Sn/Cu structure. EBSD analyses indicated preferred orientation hexagonal (η) \( (2\bar{1}\bar{1}3) \), while (100) monoclinic structure (η′). Upon increasing t 72 h, entirely transformed into Cu3Sn, IMC became Cu/Cu3Sn/Cu accordingly. Interestingly, grain size crystallographic displayed location dependence. Detailed combination transmission microscopy on performed present study. This research offers better understanding details, including crystal structure, size, orientation, after various times.
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