Inhibiting the Growth of Cu3Sn and Kirkendall Voids in the Cu/Sn-Ag-Cu System by Minor Pd Alloying
作者： Cheng En Ho , Tsai Tung Kuo , Chun Chien Wang , Wei Hsiang Wu
DOI: 10.1007/S13391-012-2049-3
关键词:
摘要: In this study, the metallurgical reaction between Cu substrates (electrolytic type) and a Sn3Ag0.5Cu-xPd alloy at 180°C was examined using scanning electron microscope (SEM), probe microanalyzer (EPMA), focused ion beam (FIB) microscope, transmission (TEM). The results showed that growth of Cu3Sn in Cu/Sn-Ag-Cu solder joints substantially suppressed by doping with minor quantity Pd (0.1–0.7 wt. %) alloy. sluggish reduced formation Kirkendall voids Cu/Cu3Sn interface significantly improved mechanical reliability joint interface. It argued addition into stabilized Cu6Sn5 phase enlarged interdiffusion coefficient but diminished neighboring (Cu3Sn), thereby decreasing effect reactive system.
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