Method and apparatus for processing a workpiece and an article formed thereby
作者： Jonathan D. Halderman , Thomas Boatwright , Thomas Chang
DOI:
关键词:
摘要: A manufacturing process is applicable to singulating die from a substrate, where the substrate has layer distinguishable by mechanical property such as brittleness. The can include providing workpiece including and disposed on first surface, modifying compression, deforming region of proximate portion having modified property; fracturing at location deformed substrate. Also, propagating crack through line along layer. formed in this manner also provided.
lens.org 参考文章(9)
Tsurugi Sudo, Jing Chai, Weizhong Sun, Cleaving edge-emitting lasers from a wafer cell ,(2008)
Volker Harle, Berthold Hahn, Method for fabricating a plurality of semiconductor chips ,(2004)
Myung cheol Yoo, Method of making diode having reflective layer ,(2002)
Bily Wang, Sung-Yi Hsiao, Jack Chen, Yu-Jen Cheng, Led package structure with a deposited-type phosphor layer and method for making the same ,(2011)
Hideo Mutou, Tomoko Higashino, Yoshiyuki Abe, Chuichi Miyazaki, Semiconductor device manufacturing method and semiconductor ,(2006)
Toshiya Kamimura, 昌樹 橋村, 俊也 上村, Shinji Shimono, 信治 下野, Masaki Hashimura, Chip division method for semiconductor wafer ,(2000)
Lee Young Woo, Ha Jin Ho, CERAMIC SUBSTRATE FOR MANUFACTURING SEMICONDUCTOR PACKAGE ,(2009)
Kanryo Koichi, Katsube Akio, Kitamura Shunsuke, Manufacturing method for electronic component module, and electronic component module ,(2013)
Ando Mamoru, Semiconductor device and manufacturing method thereof ,(2006)