Cleaving edge-emitting lasers from a wafer cell
作者： Tsurugi Sudo , Jing Chai , Weizhong Sun
DOI:
关键词:
摘要: In one example embodiment, a process for cleaving wafer cell includes several acts. First is affixed to an adhesive film. Next, the film stretched substantially uniformly. Then, further in direction that orthogonal predetermined reference direction. scribed form notch oriented parallel Finally, cleaved at location along notch.
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