Semiconductor device package with two component lead frame

摘要: Embodiments of the present invention relate to use stamping form features on a lead frame semiconductor device package. In one embodiment, portions such as pins are moved out horizontal plane diepad by stamping. certain embodiments, indentations or complex cross-sectional profile, chamfered, may be imparted and/or The complexity offered stamped profile serves enhance mechanical interlocking within plastic molding package body. Other techniques selective electroplating formation brown oxide guard band limit spreading adhesive material during die attach, employed alone in combination facilitate fabrication having features.