Introduction to Surface-Mount Technology

摘要: In chapter 1, the surface-mount technology and reflow soldering are overviewed. A brief introduction is presented into type of electronic components, including through-hole- surface-mounted ones. Steps outlined, details given regarding properties solder material in this technology. The rheological behavior pastes detailed, some recent advancements addressing thixotropic summarized. process stencil printing detailed next, which most crucial step technology; since even 60–70% failures can be traced back to process. topic includes structures stencils, discussion primary parameters, optimization possibilities by numerical modeling. Process issues component placement presented. critical parameter (process machines capability), used extensively for characterizing studied. connection with measurement capability, method Gage R&R (repeatability reproducibility) estimation respective variances. itself two main phenomena taking place when molten state, namely: wetting liquid due surface tension, intermetallic compound formation diffusion. Solder profile calculation movements during (e.g., self-alignment passive components) too. Lastly, pin-in-paste (reflow through-hole utilizing machine learning techniques.