Attila Géczy
机构: Budapest University of Technology and Economics
每年引用次数
引用次数
引用: 1,214
H-指数: 20
I10-指数 : 41
出版物: 153
Introduction to Surface-Mount Technology
Olivér Krammer , Balázs Illés , Attila Géczy
Elsevier
2020
Validation of Heat-Level Vapor Phase Soldering Process and Workspace Leakage Detection with Applied Pressure Sensors
Balázs Illés , Attila Géczy , Mohamed Alaya , Bušek David
Applied Sciences 11 ( 4) 1755
3
2021
Vapour phase soldering (VPS) technology: a review
Balázs Illés , Attila Géczy , Bálint Medgyes , Gábor Harsányi
Soldering & Surface Mount Technology 31 ( 3) 146 -156
9
2019
Corrosion-induced tin whisker growth in electronic devices: a review
Balázs Illés , Barbara Horváth , Attila Géczy , Olivér Krammer
Soldering & Surface Mount Technology 29 ( 1) 59 -68
4
2017
Investigating the thixotropic behaviour of Type 4 solder paste during stencil printing
Oliver Krammer , Benjámin Gyarmati , András Szilágyi , Richárd Storcz
Soldering & Surface Mount Technology 29 ( 1) 10 -14
7
2017
Effect of the vapour concentration decrease on the solder joints temperature in a vacuum vapour phase soldering system
Balázs Illés , Agata Skwarek , Attila Géczy , László Jakab
Soldering & Surface Mount Technology 30 ( 2) 66 -73
9
2018
Characterizing the conductivity of ICA joints by the mean intercept length of Ag flakes
Balázs Illés , Olivér Krammer , Attila Géczy , Tamás Garami
Soldering & Surface Mount Technology 28 ( 1) 2 -6
3
2016
Comparative study on proper thermocouple attachment for vapour phase soldering profiling
Attila Géczy , Bíborka Kvanduk , Balazs Illes , Gábor Harsányi
Soldering & Surface Mount Technology 28 ( 1) 7 -12
22
2016
Determination of soil density by cone index data
György Pillinger , Attila Géczy , Zoltán Hudoba , Péter Kiss
Journal of Terramechanics 77 69 -74
7
2018
Investigating Condensation Heat Transfer during Vapour Phase Soldering on Round-Shaped PCB Plates
Attila Géczy , Balázs Illés , Tamás Darnai
International Journal of Heat and Mass Transfer 86 639 -647
7
2015
Modeling method of heat transfer during Vapour Phase Soldering based on filmwise condensation theory
Attila Géczy , Balázs Illés , Zsolt Illyefalvi-Vitéz
International Journal of Heat and Mass Transfer 67 1145 -1150
18
2013
Numerical investigation on the effect of condensate layer formation around large-size components during vapour phase soldering
Balázs Illés , Attila Géczy , Olivér Krammer , Karel Dušek
International Journal of Heat and Mass Transfer 125 202 -209
5
2018
Component level modelling of heat transfer during vapour phase soldering with finite difference ADI approach
István Bozsóki , Attila Géczy , Balázs Illés
International Journal of Heat and Mass Transfer 128 562 -569
3
2019
Simplified heat transfer modeling for Vapour Phase Soldering based on filmwise condensation for different horizontal Printed Circuit Boards
Attila Géczy , Balázs Illés , Zsolt Péter , Zsolt Illyefalvi-Vitéz
Heat and Mass Transfer 51 ( 3) 335 -342
17
2015
Applied Color Sensor Based Solution for Sorting in Food Industry Processing
Mohamed Amine Alaya , Zsolt Tóth , Attila Géczy
Periodica Polytechnica Electrical Engineering and Computer Science 63 ( 1) 16 -22
1
2019
Advances in Producing Functional Circuits on Biodegradable PCBs
Bálint Kovács , , Attila Géczy , Gergely Horváth
Periodica Polytechnica Electrical Engineering and Computer Science 60 ( 4) 223 -231
13
2016
Advances on high current load effects on lead-free solder joints of SMD chip-size components and BGAs
Dániel Straubinger , Attila Géczy , András Sipos , András Kiss
Circuit World 45 ( 1) 37 -44
3
2019
Characterization of vapour phase soldering process zone with pressure measurements
Attila Géczy , Balázs Illés , Zsolt Péter , Zsolt Illyefalvi‐Vitéz
Soldering & Surface Mount Technology 25 ( 2) 99 -106
15
2013
Investigating the heat transfer on the top side of inclined printed circuit boards during vapour phase soldering
Balázs Illés , Attila Géczy
Applied Thermal Engineering 103 1398 -1407
14
2016
Oktatás a felhőben: a mikroelektronikai felhőalapú szövetség (MECA)
Attila Géczy , Olivér Krammer , Péter Martinek , Attila Bonyár
Elektronikai Technológia és Gyártásinformatika 1 ( 2) 11 -14
2018