Simplified heat transfer modeling for Vapour Phase Soldering based on filmwise condensation for different horizontal Printed Circuit Boards
作者： Attila Géczy , Balázs Illés , Zsolt Péter , Zsolt Illyefalvi-Vitéz
DOI: 10.1007/S00231-014-1386-1
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摘要: The paper presents a method for investigating heat transfer during specific reflow soldering method, Vapour Phase Soldering (VPS), where horizontal Printed Circuit Board (PCB) is heated in vapour medium. refined descriptions of filmwise condensation which were investigated and adjusted the VPS process. results show proper fast approximation measurements. dependence PCB characteristic length also investigated.
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