Investigating the heat transfer on the top side of inclined printed circuit boards during vapour phase soldering
作者： Balázs Illés , Attila Géczy
DOI: 10.1016/J.APPLTHERMALENG.2016.04.153
关键词:
摘要: Abstract In this paper, heat transfer and condensate layer formation was investigated by numerical simulations on the top side of inclined printed circuit boards during vapour phase soldering. The change surface mechanisms in were embedded a three-dimensional model. Steady-state saturated conditions applied as boundary order to study pure effect inclination. Due electronic component board structures soldering only moderate inclination angles studied between 0° 10°. It found that has considerable effects consequently transfer. Compared default horizontal orientation board, thickness differences can be decreased with an optimised board. This homogenizes process, enabling improved solder joint quality, reduced overall failure count.
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