Soldering problems of large size SMD PET capacitors during vapour phase soldering process

摘要: The reflow soldering process of large size SMD components - having a dimension over 5 mm were always challenging for the microelectronics industry because higher risk component displacement type failures like tombstone formation or skewing. In this paper, possibility such was investigated during vapour phase by numerical simulations on (4036) capacitors positioned FR4 printed circuit board substrates. A 3D computational fluid dynamic model used purpose. aim to calculate onset differences in melting solder alloy at opposite leads component. Then from time difference could be predicted. It found that considerable can form paste which cause displacement. is defined position substrate. Not recommended zones substrate avoid failure process.