Effect of the vapour concentration decrease on the solder joints temperature in a vacuum vapour phase soldering system

摘要: Purpose The vacuum vapour phase soldering method was investigated by numerical simulations. The purpose of this study to examine the temperature changes solder joints during suctioning process. A low pressure is used enhance outgassing trapped gas within joints, which otherwise could form voids. However, system loses heat near suction pipe process, and it can result in preliminary solidification before escape. Design/methodology/approach A three-dimensional flow model based on Reynolds averaged Navier–Stokes equations with standard k-e turbulence developed. effect convective transfer mechanism described model. Temperature change studied at mostly substrate component combinations, as well different settings. Findings In function thickness size, lose large amount void reduction leads entrapped voids be removed. Research limitations/implications The results provide setting information technology for appropriate optimal applications. Originality/value The relationship between generation has not been yet. possible negative effects process joint are unknown.