Thermal stability of the Al/PdxW100−x/Si contact systems

作者: M. Eizenberg , R. D. Thompson , K. N. Tu

DOI: 10.1063/1.335992

关键词:

摘要: Interactions of thin films Al and Pd‐W alloys (Pd80W20 Pd20W80) deposited on Si SiO2 have been studied using Auger‐electron spectroscopy, Rutherford backscattering spectrometry, x‐ray diffraction, forward current‐voltage measurements Schottky‐barrier height. For the bilayer inert substrate SiO2, Pd reacts with Al, forming Al‐rich Al‐Pd intermetallic compounds at 400 °C. Furthermore, in Pd‐rich (Pd80W20) permeates through whole alloy film readily 500 °C, while W‐rich Pd20W80 integrity is preserved even following annealing 600 °C. single‐crystal Si, results show extraction to both sides alloy, Pd2Si side side. In case (Al/Pd80W20/Si) contact deterioration due penetration interface observed 500 °C possibly case...

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