The aging of metallic thin films: Delamination, strain relaxation, and diffusion
作者： M. S. Kennedy , N. R. Moody , D. F. Bahr
DOI: 10.1007/S11837-007-0117-1
关键词:
摘要: The reliability of thin film systems is important to the continued development microelectronics, micro-electromechanical systems, and conventional industries. Most often, devices in these tied ability films remain adhered substrates during component lifetime. This research summary looks at aging gold their subsequent fracture from silicon substrates. mechanical integrity films, controlled by adhesion energy interface, shown be influenced strain relaxation diffusion.
springer.com
harvard.edu
sci-hub.se 参考文章(26)
V. Branger, Ch. Coupeau, Ph. Goudeau, B. Boubeker, K. F. Badawi, J. Grilhé, Atomic force microscopy analysis of buckling phenomena in metallic thin films on substrates Journal of Materials Science Letters. ,vol. 19, pp. 353- 355 ,(2000) , 10.1023/A:1006791520628
I. Milne, B. L. Karihaloo, R. O. Ritchie, Comprehensive structural integrity Elsevier. ,(2003)
Gregory T. A. Kovacs, Micromachined Transducers Sourcebook ,(1998)
P. Goudeau, N. Tamura, G. Parry, J. Colin, C. Coupeau, F. Cleymand, H. Padmore, Strain mapping on gold thin film buckling and silicon blistering MRS Proceedings. ,vol. 875, pp. 1- 6 ,(2005) , 10.1557/PROC-875-O10.4
J.W. Hutchinson, Z. Suo, Mixed mode cracking in layered materials Advances in Applied Mechanics. ,vol. 29, pp. 63- 191 ,(1991) , 10.1016/S0065-2156(08)70164-9
M.D. Kriese, D.A. Boismier, N.R. Moody, W.W. Gerberich, Nanomechanical fracture-testing of thin films Engineering Fracture Mechanics. ,vol. 61, pp. 1- 20 ,(1998) , 10.1016/S0013-7944(98)00050-2
Gerald E. Servais, Automotive demands for quality and reliability in microelectronics Quality and Reliability Engineering International. ,vol. 15, pp. 279- 282 ,(1999) , 10.1002/(SICI)1099-1638(199907/08)15:4<279::AID-QRE268>3.0.CO;2-F
Alan Lee, C.S. Litteken, R.H. Dauskardt, W.D. Nix, Comparison of the telephone cord delamination method for measuring interfacial adhesion with the four-point bending method Acta Materialia. ,vol. 53, pp. 609- 616 ,(2005) , 10.1016/J.ACTAMAT.2004.10.014
Shu-Lin Bai, Min Wang, Xue-Feng Zhao, Interfacial debonding behavior of a rigid particle-filled polymer composite Composite Interfaces. ,vol. 10, pp. 243- 253 ,(2003) , 10.1163/156855403765826892
Zhenjiang Cui, Sure Ngo, Girish Dixit, A sample preparation method for four point bend adhesion studies Journal of Materials Research. ,vol. 19, pp. 1324- 1327 ,(2004) , 10.1557/JMR.2004.0177