作者: H. Yasuda , H. Mori , M. Komatsu , K. Takeda
DOI: 10.1063/1.353272
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摘要: The alloying behavior of copper atoms into gold clusters at temperatures lower than 300 K was examined using a 200 kV transmission electron microscope equipped with double source evaporator in the specimen chamber. Isolated about 4 nm mean diameter were prepared on supporting film and cooled down to 245, 215, 165, or 125 K. Copper then deposited onto same film. Upon deposition copper, quickly changed completely partially alloyed clusters, depending upon substrate temperature. diffusivity estimated from such spontaneous many orders magnitude faster that bulk gold. A possible mechanism behind is discussed.