Method and apparatus for applying a voltage to a substrate during plating
作者： Anthony Calcaterra , David Knox
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摘要: A method for applying a strike voltage to one or more substrates during plating. During this method, the are moved in planetary manner while being held at their exterior edges by set of parallel mandrels. (The mutually orientation, typically vertically, plating.) is applied via contact pin, plate, ball bearings, rack end-plate, and
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