Enhanced cleansing process for wafer handling implements

摘要: Methods are providing for cleansing contaminants from substrates, such as semiconductor wafer handling implements, and thereby reduce the incidence of contamination devices being assembled upon wafers. In one aspect invention, a substrate cassette or other implement, is inserted into chamber that substantially isolated surrounding environment. A pressurized, optionally purified, medium directed against at least surface to dislodge surface. Dislodged evacuated with negative pressure chamber. preferred an inert gas, nitrogen, applied about 10 p.s.i. 100 more The can be provided sidewalls define convergent evacuation path in fluid communication exhaust stream, stack manufacturing facility. method monitoring contaminant particle count concentration which used control pressurized medium.