ORMOCER®S – Inorganic-Organic Hybrid Materials for e/o-Interconnection-Technology
作者： M. Popall , A. Dabek , M. E. Robertsson , S. Valizadeh , O. J. Hagel
DOI: 10.1080/10587250008023608
关键词:
摘要: Abstract Hybrid inorganic-organic polymers (ORMOCER®s) have been developed and tested for evaluation in optical electrical interconnection technology. The photopatternable materials with negative resist behaviour are composed of inorganic oxidic structures cross-linked or substituted by organic groups. They prepared from organosilane precursors sol-gel-processing combination crosslinking polymerizable functions. As a result these functionalities the properties ORMOCER®s can be adjusted to particular applications. Systematic variation composition combined adaptation micro system technology allows great flexibility processing. main features are: Combined use as dielectric passivation layers systems devices well core cladding applications enables e/o high integration levels. Postbaking at moderate temperatures (120°C – 170°C) processing on low-cost substra...
cheric.org参考文章(16)
C.J. Brinker, Sol-gel science San Diego, CA (USA); Academic Press Inc.. ,(1990)
Kris Neville, Henry Lee, Handbook of Epoxy Resins ,(1967)
C. G. Willson, L. F. Thompson, M. J. Bowden, Introduction to microlithography Crystal Research and Technology. ,vol. 30, ,(1994)
M.E. Robertsson, O.-J. Hagel, G. Gustafsson, A. Dabek, M. Popall, L. Cergel, P. Wennekers, P. Kiely, M. Lebby, T. Lindahl, O/e-MCM packaging with new, patternable dielectric and optical materials electronic components and technology conference. pp. 1413- 1421 ,(1998) , 10.1109/ECTC.1998.678929
M. Robertsson, A. Dabek, G. Gustafsson, O.-J. Hagel, M. Popall, New patternable dielectric and optical materials for MCM-L/D- and o/e-MCM-packaging Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268). pp. 203- 212 ,(1997) , 10.1109/PEP.1997.656491
T. Lindahl, Microvia technique for PCB manufacturing - a technique meeting the requirement of high interconnect density Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268). pp. 52- 55 ,(1997) , 10.1109/PEP.1997.656472
K.-H. Haas, S. Amberg-Schwab, K. Rose, G. Schottner, Functionalized coatings based on inorganic–organic polymers (ORMOCER®s) and their combination with vapor deposited inorganic thin films Surface & Coatings Technology. ,vol. 111, pp. 72- 79 ,(1999) , 10.1016/S0257-8972(98)00711-7
Doerte Schoenfeld, Oliver S. Roesch, Peter Dannberg, Andreas H. Braeuer, Roland Mueller-Fiedler, Michael Popall, Ralf Buestrich, Enhanced performance of polymer waveguides by replication and UV patterning in ORMOCER Precision Plastic Optics for Optical Storage, Displays, Imaging, and Communications. ,vol. 3135, pp. 53- 61 ,(1997) , 10.1117/12.284101
Rao R. Tummala, Michael R. Haley, George Czornyj, Materials in microelectronics Ceramics International. ,vol. 19, pp. 191- 210 ,(1993) , 10.1016/0272-8842(93)90040-X
Herbert Wolter, Werner Storch, Heidrun Ott, New Inorganic/Organic Copolymers (Ormocer ® s) for Dental Applications MRS Proceedings. ,vol. 346, pp. 143- ,(1994) , 10.1557/PROC-346-143