Variability of metal/h-BN/metal memristors grown via chemical vapor deposition on different materials

作者: Kaichen Zhu , Shaochuan Chen , Mario Lanza , Marco A. Villena , Fei Hui

DOI: 10.1016/J.MICROREL.2019.113410

关键词:

摘要: Abstract Chemical vapor deposition (CVD) is one of the most common techniques to grow large-area hexagonal boron nitride (h-BN). However, substrate on which h-BN grown plays an important role in electrical properties this insulating material. The high temperature used during CVD process produces polycrystallization metallic substrates, may modify h-BN/metal from grain another. In work, we compare CVD-grown multilayer three different substrates: Pt, Cu and Fe. This study reveals that based devices variate remarkably On contrary, behavior not relevant for when using other hand, have also studied resistive switching Au/Ti/h-BN/Pt, Au/Ti/h-BN/Cu, Au/Ag/h-BN/Fe devices, demonstrated low variability they are same grain.

参考文章(63)
Howard R. Huff, D.C. Gilmer, High dielectric constant materials : VLSI mosfet applications Springer. ,(2005)
Qiucheng Li, Xiaolong Zou, Mengxi Liu, Jingyu Sun, Yabo Gao, Yue Qi, Xiebo Zhou, Boris I. Yakobson, Yanfeng Zhang, Zhongfan Liu, Grain Boundary Structures and Electronic Properties of Hexagonal Boron Nitride on Cu(111). Nano Letters. ,vol. 15, pp. 5804- 5810 ,(2015) , 10.1021/ACS.NANOLETT.5B01852
Mohamed Ghoneim, Muhammad Hussain, Review on Physically Flexible Nonvolatile Memory for Internet of Everything Electronics Electronics. ,vol. 4, pp. 424- 479 ,(2015) , 10.3390/ELECTRONICS4030424
C. Ahn, Z. Jiang, C.-S. Lee, H.-Y. Chen, J. Liang, L. S. Liyayanage, H.-S. P. Wong, 1D Selection Device Using Carbon Nanotube FETs for High-Density Cross-Point Memory Arrays IEEE Transactions on Electron Devices. ,vol. 62, pp. 2197- 2204 ,(2015) , 10.1109/TED.2015.2433956
S. Chakraborty, M.K. Bera, S. Bhattacharya, C.K. Maiti, Current conduction mechanism in TiO2 gate dielectrics Microelectronic Engineering. ,vol. 81, pp. 188- 193 ,(2005) , 10.1016/J.MEE.2005.03.005
S. M. Sze, Current Transport and Maximum Dielectric Strength of Silicon Nitride Films Journal of Applied Physics. ,vol. 38, pp. 2951- 2956 ,(1967) , 10.1063/1.1710030
Norio Karube, Kakuji Yamamoto, Masahide Kamiyama, Thermal Oxidation of Silicon Japanese Journal of Applied Physics. ,vol. 2, pp. 11- 18 ,(1963) , 10.1143/JJAP.2.11
M. Lanza, M. Porti, M. Nafria, X. Aymerich, G. Benstetter, E. Lodermeier, H. Ranzinger, G. Jaschke, S. Teichert, L. Wilde, P. Michalowski, Crystallization and silicon diffusion nanoscale effects on the electrical properties of Al2O3 based devices Microelectronic Engineering. ,vol. 86, pp. 1921- 1924 ,(2009) , 10.1016/J.MEE.2009.03.020
Xiongfei Yu, Chunxiang Zhu, Hang Hu, A. Chin, M.F. Li, Byung Jin Cho, Dim-Lee Kwong, P.D. Foo, Ming Bin Yu, A high-density MIM capacitor (13 fF/μm/sup 2/) using ALD HfO 2 dielectrics IEEE Electron Device Letters. ,vol. 24, pp. 63- 65 ,(2003) , 10.1109/LED.2002.808159
Eli Harari, Dielectric breakdown in electrically stressed thin films of thermal SiO2 Journal of Applied Physics. ,vol. 49, pp. 2478- 2489 ,(1978) , 10.1063/1.325096