Coating processing apparatus

作者: Yuji Shimomura , Tetsuya Sada , Hiroshi Hashimoto

DOI:

关键词:

摘要: A coating processing apparatus is structured by a rotating cup having an opening portion on the top thereof for housing substrate, spin chuck substrate in cup, lid body and attached to resist solution discharge nozzle discharging onto through of body, small blocking up protrusion member provided underneath surface be positioned inside when into body. Thus, adjustment film thickness after coated can effectively performed.

参考文章(4)
Kiyohisa Tateyama, Kimio Motoda, Kazuki Denpoh, Eiji Yamaguchi, Tatsuya Iwasaki, Takenobu Matsuo, Resist processing apparatus for a rectangular substrate ,(1995)
Kiyohisa Tateyama, Kimio Motoda, Coating apparatus therefor ,(1995)
Shigemi Fujiyama, Kazunobu Yamaguchi, Hiroyoshi Sago, Solution coating apparatus ,(1992)
Kimio Motoda, Tetsu Kawasaki, Kiyomitsu Yamaguchi, Yoshitaka Matsuda, Apparatus for treating a substrate with resist and resist-treating method ,(1997)