Thermal energy dissipation using backside thermoelectric devices
作者： Nathaniel R. Chadwick , Kirk D. Peterson , Jeffrey P. Gambino
DOI:
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摘要: Embodiments of the present invention provide a semiconductor structure and method to dissipate heat generated by devices utilizing backside thermoelectric devices. In certain embodiments, comprises an electronic device formed on first side structure. The also cooling second in close proximity region where dissipation is desired, wherein includes Peltier junction. other forming
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