High performance heat shields with reduced capacitance
作者： Robert R. Robison , Anthony I. Chou , Joseph M. Lukaitis , Sungjae Lee
DOI:
关键词:
摘要: Methods and structures for capacitively isolating a heat shield from handle wafer of silicon-on-insulator substrate. A contact plug is located in trench extending through isolation region device layer the substrate at least partially buried insulator The an interconnect structure, which also includes wire coupling with plug. An structure positioned between portion wafer. provides capacitive isolation.
lens.org 参考文章(11)
Nathaniel R. Chadwick, Kirk D. Peterson, Jeffrey P. Gambino, Thermal energy dissipation using backside thermoelectric devices ,(2013)
Concetta E. Riccobene, Removal of heat from SOI device ,(2001)
Louis L. Hsu, Lawrence A. Clevenger, Tsorng-Dih Yuan, Li-Kong Wang, Method and structure for providing improved thermal conduction for silicon semiconductor devices ,(2003)
Robert R. Robison, Jed H. Rankin, Brent A. Anderson, Methods and structures for increased thermal dissipation of thin film resistors ,(2010)
Zvi Or-Bach, Brian Cronquist, Deepak C. Sekar, Semiconductor device and structure for heat removal ,(2012)
Zvi Or-Bach, Zeev Wurman, Brian Cronquist, Deepak C. Sekar, Jan Lodewijk de Jong, Israel Beinglass, System comprising a semiconductor device and structure ,(2010)
Vladislav Vashchenko, Peter J. Hopper, Yuri Mirgorodski, Integrated circuit with metal heat flow path coupled to transistor and method for manufacturing such circuit ,(2007)
Brent Keeth, Charles H. Dennison, John K. Zahurak, Method of forming a dual-gated semiconductor-on-insulator device ,(2001)
Taylor R. Efland, Thermally enhanced semiconductor chip having integrated bonds over active circuits ,(2003)
Louis Lu-Chen Hsu, Jack Allan Mandelman, Fariborz Assaderaghi, Silicon-on-insulator structure for electrostatic discharge protection and improved heat dissipation ,(1997)