Apparatus for uv damage repair of low k films prior to copper barrier deposition
作者： Victoria Shannon Benzing , Bart van Schravendijk
DOI:
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摘要: An apparatus and method for the ultraviolet (UV) treatment of carbon-containing low-k dielectric enables process-induced damage repair. A semiconductor substrate processing system may be configured to include degas plasma pre-clean modules, UV process copper diffusion barrier deposition modules seed such that is held under vacuum not exposed ambient air after low k repair before layer deposition. Inventive methods provide a damaged on with radiation induced prior breaking vacuum.
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