Semiconductor wafer defect inspection method and apparatus

摘要: A semiconductor wafer whose position information on defects a surface of the is already known, placed stage an imaging apparatus. Positions in height direction plurality points are measured. In accordance with measured positions direction, partitioned into partial areas. One area for which images still not acquired, selected from The adjusted so as to set auto focusing range. Defects imaged apparatus acquire defects. Steps between step selecting and acquiring repeated until all areas acquired.