Thiazole-and thiocarbamide-based chemicals for use with oxidative etchant solutions

作者: Michael Marsaglia , Todd Johnson , John Schemenaur , Lee Ellershaw

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摘要: Metal surfaces, particularly copper which are oxidatively micro-etched to increase surface area, provided acid-resistance by exposure a thiazole compound and/or thiocarbamide compound. The may be either in the oxidative micro-etching solution or post-micro-etching solution.

参考文章(45)
John G Poor, Carmelo L Alderuccio, Harold F Jones, Lawrence P Gould, Dissolution of metal with acidified hydrogen peroxide and use as copper etchant in manufacture of printed circuits ,(1963)
Raymond M. Ajluni, Joseph V. Otrhalek, Additive for an acid cleaning bath for metal surfaces ,(1973)
Edward A. Rodzewich, Edgar S. Hayman, James Douglas Anderson, Acid inhibitor composition and process in hydrofluoric acid chemical cleaning ,(1975)
Barry H. Williams, Peter E. Kukanskis, Thomas J. Carmody, Composition and method for improving adhesion of coatings to copper surfaces ,(1990)
Herbert D. Clark, Corrosive inhibitor compositions ,(1974)