作者: Jose L. Garcia-Gervacio , Victor Champac
DOI: 10.1109/MWSCAS.2009.5235933
关键词:
摘要: Resistive opens in vias and interconnection lines have become an issue modern nanometer technologies. These defects may produce small delays which are difficult to detect pose a reliability problem. In this paper, statistical timing analysis framework is used analyze the detectability of due resistive considering process variations. A methodology estimate fault coverage these proposed. framework, variations considered, critical affecting performance test digital circuits. Inter-die intra-die considered. Using proposed methodology, producing evaluated for some ISCAS benchmark