作者: A. Tinkelenberg , H. W. Vaessen , K. W. Suen , P. G. J. Leusink
DOI: 10.1080/00218468208073205
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摘要: Abstract Basic research on the formaldehyde emission from aminoplast-bonded particleboard has led to conclusion that F-emission is essentially governed by gross molar ratio of NH2 equivalents in material. From this starting point a new approach was chosen development glue for low-F-emission boards: such level effective F/NH2 UF or UMF standards can be met, following which methods additives are developed bring mechanical quality back an acceptable level. It shown addition approx. 10% polymeric isocyanate (PMDI) meet our purpose commercially basis. The performance system, using different UMF/PMDI compositions over range levels, described. An indication given possibilities and limitations system commercial practice.