DSC application for characterization of Urea/formaldehyde condensates
作者： M. Szesztay , Z. László-Hedvig , E. Kovacsovics , F. Tüdős
DOI: 10.1007/BF02663798
关键词: Urea 、 Differential scanning calorimetry 、 Chemistry 、 Composite material 、 Urea-formaldehyde 、 Adhesive 、 Curing (chemistry) 、 Formaldehyde 、 Reaction rate 、 Thermal decomposition
摘要: Curing process was investigated for a variety of urea/formaldehyde (UF) resin adhesives suitable particle boards and/or plywoods using DSC in anisothermal mode. In spite the very different origins (both commercial and laboratory made) several common features their thermal behaviour are noticed. The maximum curing reaction rate detected range 80–85°C. Elimination formaldehyde observed at 105–150°C. At temperatures higher than 150°C decomposition methylene linkage takes place which affects mechanical properties adhesives. According to our results good compromise can be found between product quality (production efficiency) on one hand, environmental protection (low formaldehyd emission) other.
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