作者: Frank C. Beall , Liheng Chen
DOI:
关键词: Curing (chemistry) 、 Root mean square 、 Composite number 、 Bond strength 、 Pressing 、 Hot pressing 、 Materials science 、 Urea-formaldehyde 、 Composite material 、 Adhesive
摘要: As with other composite products, the quality of particleboard is sensitive to manufacturing process. However, there still no efficient on-line technique available monitor and control most critical process in manufacture, adhesive cure during pressing. The objective this study was develop a technique, using Acousto-Ultrasonics (AU), nonintrusively bonding development hot-pressing. A series tests were run 610-by 610-mm laboratory press, which tone-burst signal fixed frequency 60 kHz injected into one platen via waveguide received at platen. Phenol-formaldehyde resin used for preliminary experiments urea-formaldehyde main study. degree curing assessed by measuring internal bond (IB), compared an AU parameter, root mean square (RMS) voltage. During consolidation, RMS reacted primarily change press pressure; subsequently, it followed increase IB reached plateau when completely cured. With extended pressing, decreased, reflecting degraded condition board. These results showed that could be index desired endpoint