Nozzle and system for use in wafer cleaning procedures

摘要: The present invention provides a system for wet processing wafer which includes chamber, in the is processed, and means supporting rotating about an upright axis within chamber. A nozzle through flow of fluid directed onto positioned downwardly over wafer. housing communication with supply at least two tubes forming angled extensions from housing. Each tube has inner end outer directs to predetermined location on while rotated each opening larger than diameter reduces pressure increases rate. also contributes substantially constant In preferred embodiment, tubes. first center area second one-third rotation will cause overflow toward edge wafer, thoroughly clean