Effects of Thiourea and Polyoxyethylene Lauryl Ether on Electrodeposition of Sn-Ag-Cu Alloy as a Pb-Free Solder
作者： Mitsunobu Fukuda , Kohei Imayoshi , Yasumichi Matsumoto
DOI: 10.1149/1.1463404
关键词:
摘要: The electrodeposition of the eutectic Sn-Ag-Cu alloy (Ag: 3.5 wt %, Cu: 0.75 %) as a Pb-free solder in an H 2 SO 4 plating bath containing thiourea and polyoxyethylene lauryl ether (POELE) additives was examined. addition necessary for stabilization all metal cations Ag + , Cu 2+ Sn Both POELE produced films with smooth surface homogeneous distribution. Thiourea adsorbed on Ag, Cu, suppressed subsequent codeposition, while only Sn, leading to suppression deposition. These effects resulted codeposition composition surface. melting point electrodeposited 216°C, which is consistent phase diagram satisfies industrial temperature requirements solders.
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