Effect of additives on the co-electrodeposition of Sn–Ag–Cu lead-free solder composition
作者： Shany Joseph , Girish J. Phatak
DOI: 10.1016/J.MSEB.2010.01.017
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摘要: Abstract We have developed a methane sulfonic acid (MSA) based ternary electrodeposition bath for the deposition of near eutectic Sn–Ag–Cu films aimed at solder bumping applications in electronics. The contains thiourea as chelating agent and iso-octyl phenoxy ethanol (OPPE) surfactant. added gelatin to this studied its effect on stability, microstructure deposited film composition. It is found that containing both additives, viz. OPPE gelatin, show improved stability up 8–10 days. Striking improvement microstructure, terms compactness, uniformity refinement grains was when contained these additives. Detailed electrochemical studies with help cyclic voltametry impedance analysis helped understanding role played by additives during deposition. confirmed there formation loosely connected, highly non-uniform passivating cathode surface, which removed competitively depositing metal ions also clear play such film.
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