Influence of current density on microstructure of pulse electrodeposited tin coatings
作者： Ashutosh Sharma , Sumit Bhattacharya , Ranjan Sen , B.S.B. Reddy , H.-J. Fecht
DOI: 10.1016/J.MATCHAR.2012.03.002
关键词:
摘要: Abstract Pulse electrodeposited tin coatings on copper substrate have been synthesized from an aqueous solution containing sodium stannate (Na 2 SnO 3 .3H O) and hydroxide (NaOH). The effect of current density surface morphology the deposits has investigated. As deposited are characterized by X-ray diffraction, scanning electron microscopy, backscatter line profile analysis. diffraction analysis shows that consist tetragonal (β-Sn) structure with microcrystalline grains. plated at lower exhibit (110) texture which decreases increasing densities. effects Cu–Sn diffusion whisker growth also reported here.
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