Effects of process parameters on the adhesive strength of copper electrodeposits in a bench-scale electrowinning cell
作者： A. Murray , H. Khakbaz , A. Pranowo , N. Aslin , M. Bobby Kannan
DOI: 10.1080/03719553.2015.1109183
关键词: Microstructure 、 Copper 、 Cathode 、 Chloride 、 Metallurgy 、 Substrate (chemistry) 、 Grain size 、 Electrolyte 、 Materials science 、 Electrowinning
摘要: In this study, the effects of various process parameters on adhesive strength copper electrodeposits stainless steel cathodes produced in a laboratory scale electrowinning cell were investigated. The experimental results showed that chloride ion concentration and current density had significant effect strength. Electrolyte temperature cupric also influenced to some extent, whereas cobaltous Guar dosage no noticeable effect. Microstructure analysis indicated which affected grain size deposit at substrate/deposit interface strength, i.e., fine grains exhibited higher than coarse grains.
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