Preventing Thermal Cycling and Vibration Failures in Electronic Equipment

摘要: Preface. Symbols. Physics of Failure In Electronic Systems. Thermal Expansion Displacements, Forces, and Stresses. Vibration Beams Other Simple Structures. Printed Circuit Boards Flat Plates. Estimating Fatigue Life in Cycling Environments. Octave Rule, Snubbers, Dampers, Isolation for Preventing Damage to Stresses Axial Leaded Component Wires Due Expansions. Designing Equipment Sinusoidal Vibration. Assessment Random on Design. Combining Cycling. Failures Surface-Mounted Components. Lead Solder Joints Dynamic Forces PCB Displacements. Long Components, Tall Small Components Mounted PCBs. Wear Interface Surface Fretting Corrosion Electrical Connectors. Case Histories Analyses. Bibliography. Index.