Characterization of Sputtered Titanium Carbide Film as Diffusion Barrier for Copper Metallization
作者： Shui Jinn Wang , Hao Yi Tsai , S. C. Sun
DOI: 10.1149/1.1385378
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摘要: … The XPS spectra were systematically recorded for both the initial surface (exposed to air) … Figures 1bd present the narrow scan XPS spectra as a function of the etching time for Ti 2p, C …
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