Memory-Module Manufacturing Method with Memory-Chip Burn-In and Full Functional Testing Delayed Until Module Burn-In

摘要: Reliable memory modules are assembled from partially-tested chips that neither individually burned-in nor fully tested. Instead, individual partially tested to screen out gross failures and then into inserted memory-module burn-in boards placed a oven. The stressed during by high temperatures applied voltages. After burn-in, the removed extensively Functional tests include many test patterns all locations in on modules. Tests performed at corner conditions such as temperature voltage. Infant mortality single-bit faults detected functional after module burn-in. number of insertions is reduced per minus one, so handling costs reduced.