Manufacturing method of light-emitting device, light-emitting device, module, and electronic device
作者： Akihiro Chida
DOI:
关键词:
摘要: A highly reliable light-emitting device is provided. yield in a manufacturing process of increased. provided which non-light-emitting portion having frame-like shape outside includes thinner than the portion. element and bonding layer are formed over substrate. The sealed by overlapping pair substrates curing layer. Then, while cured heated, pressure applied to at least with member projection.
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