Structure and method for packaging organic optoelectronic device
作者： Chi-Jen Kao , Yi-Kai Wang , Tarng-Shiang Hu
DOI:
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摘要: A structure and a method for packaging an organic optoelectronic device are provided. In this method, first substrate is provided, barrier layer disposed on the substrate. An formed layer, recess also in which forms closed loop to surround device. sealant fills recess, second device, attaches
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