Method of connecting a unit under test in a wireless test fixture

作者: L. Jack Luna

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摘要: A multilayer printed circuit board has prefabricated inner signal layers and unfinished top bottom for customizing the a particular test installation. Each layer predetermined arrangement of circuits, each having first second via pads at opposite ends circuit. The form virtual grid selective connection to points unit under test. is processed provide pad aligned with point on test, which closest available via, connecting trace between associated pad. Plated through holes are drilled outer via. Similar processing connects end assigned an interface respective terminal automated equipment.