Analysis of thermal expansion in elastic and elastoplastic layers subjected to cyclic thermal loading
作者： K. Wada , Y. Yagi , I. Nakagawa , T. Atsumi , N. Ohno
DOI: 10.1016/J.MICROREL.2010.07.012
关键词:
摘要: Abstract Thermal expansion of a Cu/Si 3 N 4 /Cu layered structure was studied by actual measurement and finite element analysis. Thicker Cu subjecting the samples to cyclic thermal loading increase structure. Strain-controlled tension/compression tests in were performed obtain characteristics plasticity. A multi-linear kinematic hardening model applied represent elastoplasticity Cu. Two sets material parameters determined: One set from initial second stabilized stress–strain relationship, respectively. It demonstrated that determined allow accurate prediction coefficient within 1 ppm/°C for structures subjected non-subjected loading.
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