Diffusion bonding of 410 stainless steel to copper using a nickel interlayer
作者： H. Sabetghadam , A. Zarei Hanzaki , A. Araee
DOI: 10.1016/J.MATCHAR.2010.03.006
关键词:
摘要: In the present work, plates of stainless steel (grade 410) were joined to copper ones through a diffusion bonding process using a nickel interlayer at a temperature range of 800–950° C …
osti.gov
elsevier.com
sci-hub.se 参考文章(21)
B. Derby, E. R. Wallach, Theoretical model for diffusion bonding Metal science. ,vol. 16, pp. 49- 56 ,(1982) , 10.1179/030634582790427028
S. Kundu, S. Chatterjee, Characterization of diffusion bonded joint between titanium and 304 stainless steel using a Ni interlayer Materials Characterization. ,vol. 59, pp. 631- 637 ,(2008) , 10.1016/J.MATCHAR.2007.05.015
B. Derby, E. R. Wallach, Diffusion bonding: development of theoretical model Metal science. ,vol. 18, pp. 427- 431 ,(1984) , 10.1179/030634584790419809
Shangda Chen, Fujiu Ke, Min Zhou, Yilong Bai, Atomistic investigation of the effects of temperature and surface roughness on diffusion bonding between Cu and Al Acta Materialia. ,vol. 55, pp. 3169- 3175 ,(2007) , 10.1016/J.ACTAMAT.2006.12.040
O Yilmaz, H Çelik, Electrical and thermal properties of the interface at diffusion-bonded and soldered 304 stainless steel and copper bimetal Journal of Materials Processing Technology. ,vol. 141, pp. 67- 76 ,(2003) , 10.1016/S0924-0136(03)00029-3
A Khodadad Motarjemi, M Kocak, V Ventzke, Mechanical and fracture characterization of a bi-material steel plate International Journal of Pressure Vessels and Piping. ,vol. 79, pp. 181- 191 ,(2002) , 10.1016/S0308-0161(02)00012-1
Osman Yilmaz, Mustafa Aksoy, Investigation of micro-crack occurrence conditions in diffusion bonded Cu-304 stainless steel couple Journal of Materials Processing Technology. ,vol. 121, pp. 136- 142 ,(2002) , 10.1016/S0924-0136(01)01224-9
M.C. Tsai, C.S. Chiou, J.S. Du, J.R. Yang, Phase transformation in AISI 410 stainless steel Materials Science and Engineering A-structural Materials Properties Microstructure and Processing. ,vol. 332, pp. 1- 10 ,(2002) , 10.1016/S0921-5093(01)01710-5
Yajiang Li, Peng Liu, Juan Wang, Haijun Ma, XRD and SEM analysis near the diffusion bonding interface of Mg/Al dissimilar materials Vacuum. ,vol. 82, pp. 15- 19 ,(2007) , 10.1016/J.VACUUM.2007.01.073
Ho-Sung Lee, Jong-Hoon Yoon, Chan Hee Park, Young Gun Ko, Dong Hyuk Shin, Chong Soo Lee, A study on diffusion bonding of superplastic Ti-6Al-4V ELI grade Journal of Materials Processing Technology. ,vol. 187, pp. 526- 529 ,(2007) , 10.1016/J.JMATPROTEC.2006.11.215