Method for manufacturing a die assembly having a small thickness and die assembly relating thereto
作者： Giorgio Allegato , Matteo Garavaglia , Lorenzo Corso , Marco Ferrera
DOI:
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摘要: A method for manufacturing a die assembly, including the steps of: bonding first wafer of semiconductor material to second wafer, respective body having initial thickness and forming an integrated electronic circuit; subsequently reducing wafer; third micro-electromechanical sensing structure.
lens.org 参考文章(7)
Gottfried Beer, Horst Theuss, Microelectromechanical semiconductor component with cavity structure and method for producing the same ,(2007)
Eric Razda, Pavan Gupta, Stacked die package for mems resonator system ,(2007)
Chia-Hua Chu, Chung-Hsien Lin, Mems device having chip scale packaging ,(2011)
Kun-Lung Chen, Integrated compact mems device with deep trench contacts ,(2012)
Sung Uk Yang, Byung Tai Do, Waferscale package system ,(2006)
Chou Shih Wen, Chip package and manufacturing method thereof ,(2012)
Masaki Inoue, Tetsuo Fujii, Semiconductor device and method of making the same ,(2010)