Array Imaging Module and Molded Photosensitive Assembly and Manufacturing Method Thereof for Electronic Device
作者： Nan Guo , Zhenyu Chen , Feifan Chen , Liang Ding , Takehiko Tanaka
DOI:
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摘要: An array imaging module includes a molded photosensitive assembly which supporting member, at least circuit board, two units, lead wires, and mold sealer. The units are coupled the chip coupling area of board. wires electrically connected sealer main body has optical windows. When is formed, board sealed by sealer, such that after portion integrally formed together position aligned with windows respectively.
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