Lead frame, manufacturing method thereof, and chip packaging method based on lead frame
作者： Si Wenquan , Chen Li
DOI:
关键词:
摘要: The invention discloses a lead frame, manufacturing method thereof, and chip packaging based on the frame. frame comprises steps: supporting plate is provided; printed with multiple through holes are fixed oppositely arranged to predetermined pattern; layer of metal plate, pattern filled by metal; removed, filling left thus, formed plate. Thus, used for printing connecting bars can be saved, density improved, cost reduced.
lens.org 参考文章(5)
Philip E. Rogren, Lead carrier with print-formed terminal pads ,(2013)
Pierre Benato, Virgile Meireles, Double-sided electronic module for hybrid smart card ,(2005)
Paolo Crema, Method and apparatus for manufacturing lead frames ,(2013)
Zhigang Bai, Hong Zhu, Yuan Zang, Liwei Liu, Zhijie Wang, Wei Gao, Lead frame for semiconductor encapsulation ,(2008)
Weihua Han, Nengjie Huang, Zhizhong Liang, Lead frame for integrated circuit or discrete components ultra-thin non-pin packing ,(2007)