Method and apparatus for manufacturing lead frames
作者： Paolo Crema
DOI:
关键词:
摘要: An embodiment of a method and an apparatus for manufacturing lead frames are described. For example, coating layer is formed on one or more predefined portions the surface substrate frame by delimiting means screen printing. The employment printing may allow obtaining large amounts with excellent electronic structural properties in quick cost-effective way.
google.gr 参考文章(21)
Douglas W. Romm, Donald C. Abbott, Semiconductor leadframes plated with thick nickel, minimum palladium, and pure tin ,(2004)
John Robert Rowlette, Jeff Cherng-Chou Wu, Richard Henry Zimmerman, Charles Parsons Brooks, Richard Taylor Williams, Selective plating by laser ablation ,(1989)
Hoi Ping Patrick Phen, Joseph Andrew Martin, King Yin Fred Fu, Electronic device with selective nickel palladium gold plated leadframe and method of making the same ,(2006)
Pierre Degott, Alexandre Sudan, Claude-Alain Despland, Edgar Mueller, Anton Bleikolm, Xiang Li, Magnetic orienting and printing ,(2009)
Donald C. Abbott, Method for fabricating preplated nickel/palladium and tin leadframes ,(2002)
Hideo Horita, Chiaki Hatsuta, Lead frame, method for partial noble plating of said lead frame and semiconductor device having said lead frame ,(1996)
Koji Ito, Minoru Nakamura, Toshihiro Mori, Masanori Akita, Hiroaki Tsuruta, Active energy beam curing type conductive paste, production method and device for conductor circuit substrate and non-contact id and production method thereof ,(2001)
Rong-Chang Liang, HongMei Zang, Scott Tseng, Sean Kiluk, Xiaojia Wang, Yi-Shung Chaug, Process for forming a patterned thin film structure for in-mold decoration ,(2004)
Kunio Katsuuma, Shiro Ichinose, Hideo Ohta, Kazuo Segawa, Apparatus for and method of screen printing on boards ,(1988)
Donald Charles Abbott, Lead frame with reduced corrosion ,(1989)