MEMS above IC technology applied to a compact RF module

摘要: Miniaturization, low cost and excellent performances at microwave and millimeterwave applications represent the main leitmotivs of the future mass market communication systems. Consequently, a novel "MEMS above IC" technology has developed in order to allow the elaboration of post-processed micro-machined passive components on top of SiGe circuits to realize a complete short-range communication receiver centered at 24 GHz. The developed technology is based on the use of : -a thick organic layer (BCB), which is employed as a dielectric membrane, -metallizations to realize the passive metal layer and also the vias to interconnect the active circuits with the post-processed passive components, -and a bulk silicon micromachining. This 'above IC' technology presents many advantages, as it uses conventional equipments of microelectronics and is in adequation with high frequency applications. A …