John Papapolymerou
机构: Chairperson and MSU Research Foundation Professor of Electrical and Computer Engineering
每年引用次数
引用次数
引用: 13,229
H-指数: 55
I10-指数 : 272
出版物: 549
Liquid Crystal polymer (LCP): a new organic material for the development of multilayer dual-frequency/dual-polarization flexible antenna arrays
G. DeJean , R. Bairavasubramanian , D. Thompson , G.E. Ponchak
IEEE Antennas and Wireless Propagation Letters 4 ( 1) 22 -26
138
2005
Linear Tapered Cavity-Backed Slot Antenna for Millimeter-Wave LTCC Modules
I. K. Kim , N. Kidera , S. Pinel , J. Papapolymerou
IEEE Antennas and Wireless Propagation Letters 5 ( 1) 175 -178
47
2006
A high performance tunable RF MEMS switch using barium strontium titanate (BST) dielectrics for reconfigurable antennas and phased arrays
Guoan Wang , T. Polley , A. Hunt , J. Papapolymerou
IEEE Antennas and Wireless Propagation Letters 4 ( 1) 217 -220
39
2005
Analysis and Characterization of a High-Performance Ka-Band Surface Micromachined Elevated Patch Antenna
B. Pan , Y.-k. Yoon , G. E. Ponchak , M. G. Allen
IEEE Antennas and Wireless Propagation Letters 5 ( 1) 511 -514
33
2006
A Printed Log-Periodic Koch-Dipole Array (LPKDA)
D.E. Anagnostou , J. Papapolymerou , M.M. Tentzeris , C.G. Christodoulou
IEEE Antennas and Wireless Propagation Letters 7 ( 7) 456 -460
107
2008
Development of V-band Integrated Front-Ends on Liquid Crystal Polymer (LCP) Technology
R. Bairavasubramanian , J. Papapolymerou
IEEE Antennas and Wireless Propagation Letters 7 ( 7) 134 -137
9
2008
Proximity Effects of Plastic Laptop Covers on Radiation Characteristics of 60-GHz Antennas
A.L. Amadjikpe , D. Choudhury , G.E. Ponchak , Bo Pan
IEEE Antennas and Wireless Propagation Letters 8 ( 8) 763 -766
6
2009
Low cost reconfigurable impedance tuner in organic substrate for system-on-package (SOP) applications
C. Lee , C. Lugo , Guizhen Zheng , J. Papapolymerou
electronic components and technology conference 1888 -1890
2005
Modeling and characterization of thin film broadband resistors on LCP for RF applications
S. Horst , S. Bhattacharya , S. Johnston , M. Tentzeris
electronic components and technology conference
10
2006
High performance system-on-package integrated Yagi-Uda antennas for W-band applications and mm-wave ultra-wideband data links
B. Pan , G. DeJean , J. Papapolymerou , M.M. Tentzeris
electronic components and technology conference 1712 -1717
5
2006
Multi-band RF and mm-wave design solutions for integrated RF functions in liquid crystal polymer system-on-package technology
V. Palazzari , D. Thompson , N. Papageorgiou , S. Pinel
electronic components and technology conference 2 1658 -1663
16
2004
3D-SOP Millimeter-Wave Fuctions for High Data Rate Wireless Systems using LTCC and LCP Technologies
J.H. Lee , S. Sarkar , S. Pinel , J. Papapolymerou
electronic components and technology conference 764 -768
12
2005
Dual-Mode Reconfigurable Filter for 3-D System-on-Package (SOP) Integration
C. Lugo , J. Hadrick , J. Papapolymerou
electronic components and technology conference 532 -535
6
2005
Advanced 3-D LTCC system-on-package (SOP) architectures for highly integrated millimeter-wave wireless systems
DeJean , Sarkar , Teritzeris , Pinel
european microwave conference 2 523 -526
2004
Compact tunable UHF bandstop resonator filter using varactor-loaded CPW bottom-side meander line
Lacroix , Papapolymerou , Jiang
european microwave conference 1063 -1066
2011
Dielectric charging in capacitive RF MEMS switches: The effect of electric stress
Negar Tavassolian , Matroni Koutsoureli , George Papaioannou , Benjamin Lacroix
asia-pacific microwave conference 1833 -1836
2010
Feasibility of T/R Module Functionality in a Single SiGe IC
John D Cressler , Jonathan Comeau , Joel Andrews , Lance Kuo
1
2005
Laser Micromachining of THz Components
Christian Drouet d'Aubigny , Christopher Walker , Bryan Jones , Christopher Groppi
2000
Coupling Between CPW and Slotline Modes in Finite Ground CPW with Unequal Ground Plane Widths
Emmanouil M. Tentzeris , John Papapolymerou , George E. Ponchak , W. D. Williams
2002
Development of a multilayer organic packaging technique for a fully embedded T/R module
Chad E Patterson , Tushar K Thrivikraman , Swapan K Bhattacharya , Chris T Coen
european microwave conference 261 -264
2011
Manos Tentzeris George E. Ponchak John D. Cressler Symeon Nikolaou A. C. Ulusoy Dimitris E. Anagnostou Guoan Wang Chad E. Patterson George Papaioannou Christos Christodoulou Fan Cai Mark G. Allen Richard W. Ziolkowski Michael J Hill Carlos A. Donado Morcillo Jong-Gwan Yook Kongpop U-yen Koutsoureli Matroni Rhonda R. Franklin Negar Ebadi