IMS2021 General Chairs' Welcome

Steve Kenney , John Papapolymerou
IEEE Microwave Magazine 22 ( 5) 32 -33

2021
Additive Manufacturing of a W-Band System-on-Package

Premjeet Chahal , John Papapolymerou , Michael Thomas Craton , Xenofon Konstantinou
IEEE Transactions on Microwave Theory and Techniques 1 -1

2021
A Bi-material Fully Aerosol Jet printed W-band Quasi-Yagi-Uda Antenna

Yuxiao He , Michael Thomas Craton , Premjeet Chahal , John Papapolymerou
global symposium on millimeter waves 1 -3

2
2018
Conductor surface-roughness effect in the loss tangent measurement of low-loss organic substrates from 30 GHz to 70 GHz

Carlos Donado Morcillo , Swapan K. Bhattacharya , Allen Horn , John Papapolymerou
electronic components and technology conference 727 -734

4
2010
Via-less X-band stacked filters on Duroid substrate

Benjamin Lacroix , Kwang Choi , Andrew T. Hunt , John Papapolymerou
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) 506 -511

2010
New microstrip-to-CPS transition for millimeter-wave application

Kyu Hwan Han , Benjamin Lacroix , John Papapolymerou , Madhavan Swaminathan
electronic components and technology conference 1052 -1057

2
2011
A feasibility study of flip-chip packaged gallium nitride HEMTs on organic substrates for wideband RF amplifier applications

Spyridon Pavlidis , A. Cagri Ulusoy , Wasif T. Khan , Outmane Lemtiri Chlieh
2014 IEEE 64th Electronic Components and Technology Conference (ECTC) 2293 -2298

6
2014
Characterization of electrical properties of glass and transmission lines on thin glass up to 50 GHz

Wasif Tanveer Khan , Jialing Tong , Srikrishna Sitaraman , Venky Sundaram
electronic components and technology conference 2138 -2143

4
2015
3D Printed High Frequency Coaxial Transmission Line Based Circuits

Michael Craton , Jennifer A. Byford , Vincens Gjokaj , John Papapolymerou
electronic components and technology conference 1080 -1087

19
2017
D-Band characterization of co-planar wave guide and microstrip transmission lines on liquid crystal polymer

Wasif Tanveer Khan , A. Cagri Ulusoy , John Papapolymerou
electronic components and technology conference 2304 -2309

27
2013
A W-band CMOS PA encapsulated in an organic flip-chip package

Chad E. Patterson , Debasis Dawn , John Papapolymerou
international microwave symposium 1 -3

22
2012
Novel stretchable electrically conductive composites for tunable RF devices

Fan Cai , Zhuo Li , Joshua C. Agar , C. P. Wong
international microwave symposium 1 -3

4
2012
Hybrid silicon-organic packaged antenna array at 60 and 80 GHz using a low-cost bonding technique

Aida L. Vera Lopez , Akira Akiba , Koichi Ikeda , Shun Mitarai
international microwave symposium 1 -3

4
2012
A 94 GHz flip-chip packaged SiGe BiCMOS LNA on an LCP substrate

Wasif Tanveer Khan , Cagri Ulusoy , Mehmet Kaynak , Herman Schumacher
international microwave symposium 1 -4

6
2013
Dual frequency organically packaged antenna arrays at 57 and 80 GHz

Aida L. Vera Lopez , Wasif T. Khan , John Papapolymerou
international microwave symposium 1 -4

3
2013
L-band tunable microstrip bandpass filter on multilayer organic substrate with integrated microfluidic channel

Outmane Lemtiri Chlieh , Wasif T. Khan , John Papapolymerou
international microwave symposium 1 -4

11
2014
Integrated microfluidic cooling for GaN devices on multilayer organic LCP substrate

Outmane Lemtiri Chlieh , Carlos A. Donado Morcillo , Spyridon Pavlidis , Wasif T. Khan
international microwave symposium 6697787

9
2013
Integrated microfluidic cooling of high power passive and active devices on multilayer organic substrate

Outmane Lemtiri Chlieh , Wasif T. Khan , John Papapolymerou
international microwave symposium 1 -4

6
2014
High resolution aerosol jet printing of D-band printed transmission lines on flexible LCP substrate

Fan Cai , Yung-hang Chang , Kan Wang , Wasif Tanveer Khan
international microwave symposium 1 -3

34
2014
A low loss X-band filter using 3-D Polyjet technology

Fan Cai , Wasif Tanveer Khan , John Papapolymerou
international microwave symposium 1 -4

18
2015