引用次数
引用: 13,487
H-指数: 59
I10-指数 : 200
出版物: 533
2.2 GHz LC VCO for RFID on a 0.5-μm digital gate-array designed for ultra-thin silicon substrates
Berroth , Burghartz , Scherjon , Abdelfattah
german microwave conference 1 -4
2011
Selective Epitaxy Base for Bipolar Transistors
Chen , Harame , Burghartz , Mader
european solid state device research conference
2
1988
Embedding and Interconnecting of Ultra-Thin RF Chip in Combination with Flexible Wireless Hub in Polymer Foil
Golzar Alavi , Sefa ozbek , Mahsa Rasteh , Markus Grozing
2018 7th Electronic System-Integration Technology Conference (ESTC)
2
2018
Microbolometer technology using serial pn-diodes
D. B. Etter , S. Sun , F. X. Hutter , J. N Burghartz
international semiconductor conference 1 -4
2013
ESSCIRC Author Index
F Abbate , O Abed-Meraïm , P Absil , N Akahane
Optoelectronics on fiber: towards all-in-fiber autonomous optrodes
A Ricciardi , M Zimmer , N Witz , A Micco
Optical Fiber Sensors Tu3. 2 -Tu3. 2
2022
Vertical integration of RF passive components in stacked wafer-level packages
Marian Bartek , S Sinaga , J Burghartz
European Microelectronics and Packaging Conference & Exhibition (EMPC) 190 -194
3
2005
FP 16.1: RF Circuit Design Aspects of Spiral Inductors on Silicon
J Burghartz , D Edelstein , M Soyuer , H Ainspan
Extraction of Collector Resistance for Compact Models
Hsien-Chang Wu , S Mijalkovic , J Burghartz
PTUC: Will micromachining ever make it into RF/microwave silicon volume manufacturing?
J Burghartz , RF Drayton ,
international microwave symposium 1
2004
Axelevitch, A. Babaii-Rizvandi, N. Bain, M. Bauer, AJ Baureis, P.
I Adesida , SJ Ahn , M Aleman , V Aliberti
A novel active harmonic load-pull setup for on-wafer device linearity characterization
M Spirito , LCN De Vreede , M De Kok , M Pelk
international microwave symposium 2 1217 -1220
15
2004
Characterization of ferroelectric thin film materials for FeRAM
Son Hoang Le , Behzad Rejaei Salmassi , Johachim N Burghartz , Pasqualina M Sarro
Semiconductor advances for future electronics, Veldhoven, Te Netherlands 710 -713
8
2004
ThroughSilicon via technology in chipfilm substrates for 3d-integration
Saleh Ferwana , Christine Harendt , Andreas Kern , Florian Letzkus
proc. of ICT. OPEN 2011 conference on Semiconductor Advances for Future Electronics and Sensors (SAFE) 63 -66
4
2011
Trends in Digital Imaging
JOACHIM N BURGHARTZ , HEINZ-GERD GRAF , CHRISTINE HARENDT
Status and Trends in Silicon RF Technology
J.N. Burghartz
european solid-state device research conference 1 56 -63
3
1999
Size reduction and tuning of integrated folded patch antennas using slots
J.H. Correia , M. Bartek , P.M. Mendes , J.N. Burghartz
european microwave conference 3 1337 -1340
2
2004
Large signal verification of the circuit-oriented smoothie database model for LDMOS devices
V Cuoco , O Yanson , P Hammes , M Spirito
european microwave conference 1 217 -220
4
2004
Opportunities for Standard Silicon Technology in RF&Microwave Applications
M. Soyuer , Y.H. Kwark , J.F. Ewen , K.A. Jenkins
european solid state device research conference 363 -366
5
1995
Self-aligned SiGe-base heterojunction bipolar transistor by selective epitaxy emitter window (SEEW) technology
J.N. Burghartz , J.H. Comfort , G.L. Patton , B.S. Meyerson
IEEE Electron Device Letters 11 ( 7) 288 -290
35
1990