Guanglan Liao
机构: Huazhong University of Science and Technology
每年引用次数
引用次数
引用: 6,273
H-指数: 44
I10-指数 : 144
出版物: 282
Automated X-ray recognition of solder bump defects based on ensemble-ELM
Lei Su , LingYu Wang , Ke Li , JingJing Wu
Science China-technological Sciences 62 ( 9) 1512 -1519
9
2019
Optical properties of the micro/nano structures of Morpho butterfly wing scales
GuangLan Liao , HaiBo Zuo , YanBo Cao , TieLin Shi
Science in China Series E: Technological Sciences 53 ( 1) 175 -181
15
2010
Investigation on color variation of Morpho butterfly wings hierarchical structure based on PCA
Xuan Jiang , TieLin Shi , HaiBo Zuo , XueFeng Yang
Science China Technological Sciences 55 ( 1) 16 -21
5
2012
Au modified ZnO nanowires for ethanol gas sensing
YouNi Wu , Ting Jiang , TieLin Shi , Bo Sun
Science China Technological Sciences 60 ( 1) 71 -77
8
2017
Intelligent diagnosis of the solder bumps defects using fuzzy C-means algorithm with the weighted coefficients
XiangNing Lu , TieLin Shi , SuYa Wang , LiYi Li
Science China Technological Sciences 58 ( 10) 1689 -1695
6
2015
Bio-inspired manufacturing of superwetting surfaces for fog collection and anti-icing applications
XuNing Zhang , Lang Gan , Bo Sun , ZhiYong Liu
Science China Technological Sciences 65 ( 9) 1975 -1994
1
2022
Fringe contrast enhancement of digital off-axis hologram via sparse representation
Yuan Hong Yuan Hong , Tielin Shi Tielin Shi , Yichun Zhang Yichun Zhang , and Guanglan Liao and Guanglan Liao
Chinese Optics Letters 14 ( 6) 060901 -60905
1
2016
Using improved YOLOv5s for defect detection of thermistor wire solder joints based on infrared thermography
Yu-Chuan Bian , Guang-Hui Fu , Qing-Shu Hou , Bo Sun
Smpte Journal 29 -32
7
2021
Defects detection for flip chip using modal analysis
Miao Zeng , Guang-Lan Liao , Xue-Kun Zhang , Jun-Chao Liu
Zhendong yu Chongji(Journal of Vibration and Shock) 32 ( 6) 24 -28
2013
Using improved YOLOv5s for defect detection of thermistor wire solder joints based on infrared thermography
Yu-Chuan Bian , Guang-Hui Fu , Qing-Shu Hou , Bo Sun
2021 5th International Conference on Automation, Control and Robots (ICACR) 29 -32
13
2021
Application of UV radiation in silicon wafer surface activation bonding
Xiao-hui LIN , Tie-lin SHI , Guang-lan LIAO , Zi-rong TANG
Journal of Functional Materials and Devices 2 015 -015
2
2008
Parameter optimization of surface activation on silicon wafer
Lei NIE , Chuan-zhi RUAN , Guang-lan LIAO , Tie-lin SHI
Journal of Functional Materials
2011
Measurement of Surface Energy for Wafer Direct Bonding
Guang-lan LIAO , Mei-cheng WANG , Tie-lin SHI , Yu-ping SHI
Studyofreactionionetchingprocessingtechnique
X LAIW , GL LIAO
SemiconductorTechG nology 31 ( 6) 414G417 -414G417
4
2006
Research on the measurement of small optical element with aspheric surface
MCH WAN , GL LIAO , TL SHI
Metrology & Measurement Technology 27 ( 4) 1 -4
2
2007
Study on Micro-forming Process of Zr-based Bulk Metallic Glass with Silicon Mold
Dong WANG , An-Lan LIAO , JIE BO , Beng BANG
China Mechanical Engineering 21 ( 02) 222 -222
2010
Affine Image Registration Using Weighted Iterative Closest Point Algorithm
Ying Yan , Qi Xia , Ke Wang , Guanglan Liao
international conference on electronics communications and control 3335 -3338
2012
FDTD simulation of near-field fiber probe with distinctive tapered structures
Guanglan Liao , Shiyuan Liu , Xiaoping Li , Bo Gong
2012 International Conference on Fiber Optics and Photonics (PHOTONICS)
2012
Characterization of dielectric function for metallic thin films based on ellipsometric parameters and reflectivity
Chuanwei Zhang , Honggang Gu , Guanglan Liao , Xiuguo Chen
Physica Scripta 94 ( 8) 085802
5
2019
Annealed AlOx film with enhanced performance for bipolar resistive switching memory
Guanglan Liao , Zhiyong Liu , Tielin Shi , Bo Sun
Applied Surface Science 546 149094
2021